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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliabilit

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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliabilit

  • 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliabilit
  • 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliabilit
  • 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliabilit
  • 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliabilit
Contact Now

30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliabilit

30µm (1.2mil) gold wire is widely used in aerospace components requiring higher current load, stronger mechanical strength, and better vibration resistance. This article focuses on the conductivity ...

Product Tags:

30 μm gold bonding wire

      

high-reliability semiconductor bonding wire

      

fine-pitch wire bonding wire

      
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