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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

Brand Name : WINNER

Model Number : MW001

Certification : ISO9100

Place of Origin : CHINA

MOQ : 1PC

Price : 999

Payment Terms : L/C,Western Union,T/T

Supply Ability : 100000 rolls per month

Delivery Time : 5-8 WORKING DAYS

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Application : Semiconductor Packaging, Microelectronics, Medical Devices

Package : Spool

Corrosion Resistance : High

Material : Gold

Length Meters : 500/1000

Product Type : Bonding Wire

Coating : Gold

Bonding Method : Ultrasonic

Temperature Range : -40°C to 200°C

Surface Finish : Bright

Conductivity : 98%

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30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor
30µm (1.2mil) gold wire is widely used in aerospace components requiring higher current load, stronger mechanical strength, and better vibration resistance. This article focuses on the conductivity stability of 18µm (0.7mil) gold bonding wire, its advantages, and typical applications in aerospace—for engineers, purchasers, and R&D teams seeking high‑reliability bonding solutions.
Features
  • Designed specifically for wire bonding
  • Au100 alloy
  • 1,064°C (1,947°F) melting point
  • Lead-free, RoHS 3 compliant, and REACH compliant
  • 100m (328 feet) length
  • >12 months shelf life
  • 4N (>99.99%) purity
  • 950mg wire weight
30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor

Product Tags:

30 μm gold bonding wire

      

high-reliability semiconductor bonding wire

      

fine-pitch wire bonding wire

      
Wholesale 30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor from china suppliers

30 Μm (1.2 Mil) Gold Bonding WIRE For Fine-pitch Wire Bonding In High‑reliability Semiconductor Images

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